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8-layered Main Board for Mobile Phones, with OSP BGA Surface Finish

Model Number: smart-009

 
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Main Export Markets:
  • Eastern Europe
  • North America
  • Mid East/Africa
  • Central/South America
  • Asia
  • Western Europe
  • Australasia
 
Key Specifications/Special Features:
  • 8-layer main board for mobile phone
  • Minimum line width/space: 3mils
  • Surface finish: immersion gold
  • BGA surface finish: OSP
  • Board thickness: 39.4mils
  • Minimum drilled hole diameter: 5mils
  • Minimum BGA PAD size: 10mils
  • Copper thickness: 1/2oz
  • Impedance: 50Ω, ±10%
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Contact Details  

Smart Power Industry (H.K.) Co.,Ltd
Room 706, Baoyuan Building
Baoyuan Road, Xixiang Street
Bao'an District
Shenzhen
Guangdong
China  518102
Tel:  (86 755) 29589452  (86 755) 29589453
Fax:  (86 755) 29589453
Homepage Address
http://www.globalsources.com/smartpower.co


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Key Contact:
Mr  Yuan,  Chris
Sales Manager
Sales Department

Supplier and product information updated April 06, 2012.
Verified Business Registration Details
Registered Company: Smart Power Industry (H.K.) Co.,Ltd
Business Registration Number: 38757558-000-12-10-6
Company Registration Address: UNIT D 16/F CHEUK NANG 21ST CENTERY PLAZA 250 HENNESSY ROAD WANCHAL HK
* In some jurisdictions, company names and addresses are registered in Chinese only.
This supplier has been verified by Global Sources. Our verification process includes 3 on-site visits, financial checks and more...
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